SI-IC Chiplet

Chiplets Come to Life

Efficient Fabric
Enabling heterogeneous chiplet integration with short‑reach die‑to‑die links and high bandwidth density. The result is a clean path to scale compute, memory, and I/O.
Creates a scalable path for compute, memory, and I/O inside modern packages.
Links die-to-die fabrics with high-speed off-package interfaces.
Delivers high bandwidth per millimeter with compact multi-lane scaling.
Powering dense chiplet connectivity.
Edge bandwidth. Scalable. Efficient.
architecture

Built for High-Density Chiplet Connectivity

ForestSemi’s Si‑IC chiplets focus on what makes chiplet systems succeed in production: dense, efficient connectivity between dies.

Our die‑to‑die fabric is optimized for high bandwidth density along the shoreline, enabling large aggregate throughput in compact packages while keeping power and latency under control.

Connectivity Fabric

A Fabric-First Approach to Chiplet Connectivity

Fabric-First Connectivity
Supports wide interfaces, high per-lane throughput, and scalable multi-die architectures.
Predictable Link Behavior
Ensures stable links and reliable performance during integration.
Scalable Lane Architecture
Flexible lane configurations enable efficient scaling across chiplet designs.
Packaging-Aware Design
Delivers more bandwidth in less shoreline with efficient die-to-die performance.
Packaging-Aware Design
Delivers more bandwidth in less shoreline with efficient die-to-die performance.

Download the detailed technical specifications and architecture overview.

Download Datasheet
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